Advanced Packaging Yield and Data Analytics Director - Advanced Micro Devices

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Advanced Packaging Yield and Data Analytics Director

The Role:

We are seeking a highly skilled and visionaryAdvanced Packaging Yield and Data Analytics Directorto lead our efforts in advanced packaging yield enhancement and next-generation data analytics innovation. This role is at the intersection of semiconductor manufacturing, AI-driven analytics, and heterogeneous integration, with a focus on enabling best-in-class yield performance across AMD’s portfolio- including client, server, gaming, and AI products. The ideal candidate is both adata scientist and a yield technologist, capable of shaping and executing a roadmap that drives yield improvements while defining and deploying cutting-edge analytics and machine learning tools. This individual will work closely with design, R&D, operations, and supply chain partners worldwide to defineDesign for Manufacturing (DFM)andDesign for Yield (DFY)standards and develop scalable analytics systems across AMD’s diverse advanced packaging ecosystem.

Key Responsibilities:

• Lead yield improvement initiatives across advanced packaging technologies (2.5D, 3D-IC, fan-out, etc.) for AMD’s high-performance computing products
• Define and implement yield prediction tools and methodologies for heterogeneous integration
• Collaborate with product design teams and technology development partners to incorporate DFM/DFY practices
• Develop a comprehensive roadmap for AI and analytics tools tailored to advanced packaging yield challenges
• Partner with internal IT and external analytics providers to build and deploy scalable, automated yield tracking and decision-making systems
• Engage with global OSATs, substrate suppliers, and foundry partners to identify and resolve yield pain points using data-driven approaches
• Evangelize data analytics capabilities and mentor engineers in best practices for yield analytics and AI-driven insights
Contribute to AMD’s system technology co-optimization strategy through deep data integration across design and manufacturing

The Person:

You are an experienced technical leader with a hands-on approach to data science and semiconductor manufacturing. You bring a strong foundation instatistical analysis, machine learning, and advanced packaging technologies, and you're adept at leading cross-functional teams toward complex yield and analytics goals. You possess excellent communication skills and can distill complex data insights into actionable recommendations for engineering and executive stakeholders alike.

Preferred Experience:

• 15+ years in semiconductor packaging with a focus on advanced architectures (e.g., 2.5D, 3D die stacking, chiplet integration)
• 5+ years in a leadership role managing yield engineering or data science teams
• Proven experience deploying machine learning and data analytics to drive yield improvements
• Hands-on expertise with SQL, Python, JMP/JSL, and analytics environments (e.g., Jupyter Notebooks)
• Experience with cloud-based data warehouse and analytics platforms (e.g., AWS, Azure, Snowflake) is a strong plus
Deep familiarity working with external manufacturing partners, including OSATs, substrate vendors, and foundriesin driving yield improvements through data analytics.
• Proven track record of driving Advanced packaging solutions from R&D to HVM

Academic Credentials:

• BS/MS/PhD inComputer Science, Applied Mathematics, Electrical Engineering, Mechanical Engineering, or related technical discipline

Location: Austin, TX

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